Bill of Materials
 
SSOP (300 MILS)
Leadframe A194(Cu)
Die Attach Conductive Epoxy 84-1LMIS R4 / CRM1076NS
Wire Bond Gold wire 1.0 mil
Molding compound EME 6600CA / G600
Marking  White Ink / Laser
Lead Finish Solder plate ( Sn/Pb : 85/15 ) & ( Sn/Pb : 99.99/0 )
Packing Antistatic Tubes /  Reels / Pouches