| Packaging & Assembly Technology |
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| SPEL has a strong product
engineering team which includes design support, design
optimization and characterization services. These are
offered for new product developments and for customer
support. |
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| SPEL has designed and
optimized over a 100 variants of leadless molded packages (LMPs)
to cater to the varying needs of the customer. Please refer
to the list of
Packaging options |
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| The
services offered by our Product Engineering team includes: |
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- Package Design support |
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- Package Selection and
Optimization |
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- Die Layout guideline |
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- Prototyping & Process
Optimization |
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| Test Development |
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| SPEL offers full turnkey and test solutions for a
variety of Logic, Mixed-signal, Analog & Linear semiconductor
testing. We also provide technical planning and cost optimization
solutions. Test engineering and characterization are also offered.
We can also port existing test programs into our tester platforms
for scale production. |
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| Wafer Probing: |
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- Provide test solutions upto 200mm fine
pitched wafers |
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- Probe card design and development |
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- Various tester platforms for enhansed
performance and cost |
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| Final Testing: |
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- Engineering support for test program
development and debugging |
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- Logic, Mixed-Signal, RF an Linear
semiconductor testing |
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- Develop multi-site capability for
devices |
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- Provide test conversion solutions for
improving test yield, cost and throughput |
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- Develop test solutions for various test
handlers/interfaces |
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| Charecterization / Prototyping: |
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- Device characterizations including
corner wafers and engineering prototypes |
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- Pilot production lots, yield
improvement measures and tester stability |
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- Support for Reliability, Burn-In, HTOL,
HTOS services |
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- We also provide engineering tester
hours on rental basis |
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