SPEL Semiconductor Ltd, India’s 1st & Only Semiconductor IC Assembly & Test Company and Silicon Core Technologies (SCT) signed an MOU on Apr 3, 2007 at Chennai. The MOU was signed during an interactive business meeting organized by the Southern India Chamber of Commerce and Industry (SICCI) for a delegation from Zhaoping High Technology Development Zone of China.

This new business partnership between SPEL & SCT will see SPEL offer its proven technology, process & expertise in setting up a state-of-the-art IC Assembly & Test facility within China’s Guangdong province. SPEL & SCT have been in business together for the last 5 years.

SPEL, which has spearheaded the Indian semiconductor industry by successfully demonstrating its capabilities for nearly 2 decades, is currently on a major expansion mode. With the current capacity of 252 Million ICs per annum, SPEL’s expansion will add additional capacity thereby totaling to 572 Million ICs per annum by July 2007.

Mr. Sam Varghese, CEO SPEL & Mr. Eric Li, CEO & President, SiliconCore technology represented the two companies in signing the MoU. The event was graced by Mr. UmaShankar MD, ELCOT & Mr. Longping Liu, Hon. President – Secretary CPC , Zhaoping High technology Industry Development Zone , Zhaoping City China.